METHOD FOR PROCESSING, IN PARTICULAR SEPARATING, A SUBSTRATE BY MEANS OF LASER-INDUCED DEEP REACTIVE ETCHING

METHOD FOR PROCESSING, IN PARTICULAR SEPARATING, A SUBSTRATE BY MEANS OF LASER-INDUCED DEEP REACTIVE ETCHING

A method for machining, in particular for cutting an, in particular, planar substrate by laser-induced deep etching includes: moving laser radiation along a machining line; directing individual pulses onto the planar substrate at a spatial laser pulse distance (d); and subsequently removing an aniso...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SCHNOOR, Arne, OSTHOLT, Roman, AMBROSIUS, Norbert, DUNKER, Daniel
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
GLASS
MACHINE TOOLS
MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
MINERAL OR SLAG WOOL
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:A method for machining, in particular for cutting an, in particular, planar substrate by laser-induced deep etching includes: moving laser radiation along a machining line; directing individual pulses onto the planar substrate at a spatial laser pulse distance (d); and subsequently removing an anisotropic material by etching at an etching rate (r) and an etching duration (t). Machining parameters are set according to a condition: 1>d/(R*t)>10−5.