METHODS OF FORMING SUPPORTING SUBSTRATES FOR CUTTING ELEMENTS, AND RELATED CUTTING ELEMENTS, METHODS OF FORMING CUTTING ELEMENTS, AND EARTH-BORING TOOLS

A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to for...

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Bibliographische Detailangaben
1. Verfasser: BIRD, Marc, W
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, Al, W, and C. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.