DRY FILM RESIST STRIPPING SOLUTION COMPOSITION

The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Kyusang, HA, Sangku, BAE, Jongil, LEE, Jongsoon, CHOI, Hosung, YANG, Yunmo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.