RESIN POWDER, DEVICE AND METHOD OF MANUFACTURING A SOLID FREEFORM OBJECT

A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder. Further claimed is a device 200 for manufacturing a solid freeform object comprising a lay...

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Bibliographische Detailangaben
Hauptverfasser: MUTOH, Toshiyuki, SUN, Yunsheng, NARUSE, Mitsuru, IWATSUKI, Hitoshi, YAGUCHI, Shigenori, IIDA, Sohichiroh
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A resin powder contains a resin, wherein the proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder. Further claimed is a device 200 for manufacturing a solid freeform object comprising a layer forming device 14 configured to form a layer comprising a resin powder comprising a resin, and a powder attaching device 15 configured to attach the resin powder in a selected area of the layer, wherein a proportion of fine powder having a number diameter of 40 percent or less of a mean number diameter Mn of the resin powder is 30 percent or less in the resin powder.