FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL PROVIDED WITH SUPPORT SHEET, METHOD FOR MANUFACTURING FILM-SHAPED FIRING MATERIAL, AND METHOD FOR MANUFACTURING FILM-SHAPED FIRING MATERIAL PROVIDED WITH SUPPORT SHEET

This film-shaped firing material is a film-shaped firing material (1a) containing sinterable metal particles (10) and a binder component (20), in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion (A) is deemed 100%, the average thickness o...

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Bibliographische Detailangaben
1. Verfasser:	ICHIKAWA Isao
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASTING CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING METALLIC POWDER WORKING-UP
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Beschreibung
Zusammenfassung:	This film-shaped firing material is a film-shaped firing material (1a) containing sinterable metal particles (10) and a binder component (20), in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion (A) is deemed 100%, the average thickness of the edge portion (A) of the film-shaped firing material (1a) is at least 5% thicker than the average thickness of the portion (B) of the film-shaped firing material (1a) excluding the edge portion (A).