SEALING APPARATUS FOR FORMING VOID-FILL PACKAGING
There is provided a sealing apparatus for forming void-fill packaging which includes a longitudinal guide path along which an edge of a part-sealed plastics film material can pass, a drive means for moving the film material along the guide path, and an air blowing or injecting means for inflating th...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | There is provided a sealing apparatus for forming void-fill packaging which includes a longitudinal guide path along which an edge of a part-sealed plastics film material can pass, a drive means for moving the film material along the guide path, and an air blowing or injecting means for inflating the film material. There is also provided a heating element and a rigid thermally conductive member which is thermally coupled to the heating element, the thermally conductive member having an film-contacting surface for applying thermal energy to seal the film material on the longitudinal guide path. |
---|