EPOXY-SILICONE HYBRID SEALANT COMPOSITION WITH LOW SHRINKAGE AND LOWER POSTCURING PROPERTIES WITH CHEMICAL RESISTANCE FOR AEROSPACE APPLICATIONS

In one aspect of the present disclosure, there is provided a sealant precursor, comprising a first part (A) comprising (a1) an epoxy curing agent having an amine equivalent weight of at least 150 grams per mole of amine equivalents; (b1) a first epoxy curative; a second part (B) comprising (a2) a bl...

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Bibliographische Detailangaben
1. Verfasser:	BARDTS, Mareike
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	In one aspect of the present disclosure, there is provided a sealant precursor, comprising a first part (A) comprising (a1) an epoxy curing agent having an amine equivalent weight of at least 150 grams per mole of amine equivalents; (b1) a first epoxy curative; a second part (B) comprising (a2) a blend of epoxy resins comprising at least one bisphenol A epoxy resins and at least one bisphenol F epoxy resin; (b2) at least one silicone-based resin comprising epoxy functionalities; (c2) optionally, a toughener.