MOLDED BODY FOR JOINING AND METHOD FOR MANUFACTURING SAME

The present invention is directed to a molded body (1) for joining composed of a compressed aggregate of Cu-core Sn-shell powders, the molded body for joining being such that an activating agent-containing substance (3) for removing oxides on the surfaces of the powders exists both in closed holes a...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGUCHI, Tomohiko, IWATA, Kotaro, HIGAMI, Akihiro, MURAOKA, Hiroki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	The present invention is directed to a molded body (1) for joining composed of a compressed aggregate of Cu-core Sn-shell powders, the molded body for joining being such that an activating agent-containing substance (3) for removing oxides on the surfaces of the powders exists both in closed holes and open holes therewithin, that it contains Cu in a ratio of 55 to 95% by mass and Sn in a ratio of 45 to 5% by mass, that an activating agent in the activating agent-containing substance is included in a ratio of 0.01 to 2% by mass to 100% by mass of the molded body for joining, and that it has a thickness of 20 to 400 µm.