HEAT TREATMENT DEVICE

HEAT TREATMENT DEVICE

A heat treatment device (1) utilizing heat exchange between a first fluid (M) and a second fluid (HC) includes first heat transfer bodies (7) including first flow channels (17) through which the first fluid (M, P) flows, second heat transfer bodies (9) including second flow channels (31) through whi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YANO Akihisa, SHIBUYA Hideshi, OKA Tatsuya, TAKEUCHI Yusuke, KAMATA Hiroyuki, YAMAMOTO Taiga, AKITA Takahito
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BLASTING
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY
CHEMISTRY
COMPOUNDS THEREOF
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
INORGANIC CHEMISTRY
LIGHTING
MECHANICAL ENGINEERING
METALLURGY
NON-METALLIC ELEMENTS
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
THEIR RELEVANT APPARATUS
TRANSPORTING
WEAPONS
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Beschreibung
Zusammenfassung:A heat treatment device (1) utilizing heat exchange between a first fluid (M) and a second fluid (HC) includes first heat transfer bodies (7) including first flow channels (17) through which the first fluid (M, P) flows, second heat transfer bodies (9) including second flow channels (31) through which the second fluid (HC) flows, the second heat transfer bodies (9) each being stacked on the respective first heat transfer bodies (7), and a casing (53, 57) having a space (S2, S3) communicating with the second flow channels (31), the casing (53, 57) being in contact with each surface including the edge of the connection interface between each first heat transfer body (7) and each second heat transfer body (9). The first heat transfer bodies (7) each further include a third flow channel (18, 24) provided in a wall portion (19, 13) isolating the first flow channels (17) from the space (S2, S3) of the casing (53, 57). The first flow channels (17) are grooves in contact with the connection interface, and the third flow channel (18, 24) is a groove in contact with the connection interface and intersecting with a virtual line (LI, L2) connecting the first flow channels with the space (S2, S3) of the casing (53, 57) at the connection interface.