HEAT DISSIPATION METHOD AND HEAT DISSIPATION SYSTEM

The present invention relates to a process for removing heat, comprising the steps of: generating liquid fine particles comprising at least one vaporable liquid; transporting the liquid fine particles to a heat source; and vaporizing the liquid fine particles in the vicinity of the heat source witho...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	HASHIBA Tomohiko
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMBINED HEATING AND REFRIGERATION SYSTEMS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT PUMP SYSTEMS HEATING LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PRINTED CIRCUITS REFRIGERATION MACHINES, PLANTS OR SYSTEMS REFRIGERATION OR COOLING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	The present invention relates to a process for removing heat, comprising the steps of: generating liquid fine particles comprising at least one vaporable liquid; transporting the liquid fine particles to a heat source; and vaporizing the liquid fine particles in the vicinity of the heat source without contacting the liquid fine particles with the heat source, wherein the heat of the heat source is removed by the heat of vaporization of the liquid fine particles, as well as a system for removing heat which can perform the process for removing heat. The process and system for removing heat according to the present invention can exert high cooling efficiency because they can directly remove heat from the heat source.