DISPERSION, METHOD FOR PRODUCING CONDUCTIVE PATTERN-EQUIPPED STRUCTURE BY USING DISPERSION, AND CONDUCTIVE PATTERN-EQUIPPED STRUCTURE

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a...

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Hauptverfasser: TSURUTA, Masanori, OHNO, Eiichi, YUMOTO, Toru
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).0.0001≤reductantmass/copperoxidemass≤0.100.0050≤dispersingagentmass/copperoxidemass≤0.30The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.