FOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING A FOLDABLE LAYERED CONNECTION

The present inventive concept relates to a foldable layered connection (100, 500) comprising: a substrate (102, 502) having a first major surface (104, 504) and an opposing second major surface (106, 506); a node of connector material (120, 520) arranged to contact the substrate (102, 502) via the f...

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Bibliographische Detailangaben
Hauptverfasser:	Isabel Pinheiro Cardoso de Freitas, Susana, Maria Alves Dias, Rosana, Jorge Peixeiro de Freitas, Paulo, Carlos Azevedo Gaspar, Joâo, Ferreira, Ricardo, Filipe Rodrigues Franco, Fernando
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present inventive concept relates to a foldable layered connection (100, 500) comprising: a substrate (102, 502) having a first major surface (104, 504) and an opposing second major surface (106, 506); a node of connector material (120, 520) arranged to contact the substrate (102, 502) via the first major surface (104, 504); a released extension (126, 526) comprising a core of connector material arranged to be in communicative contact with the node of connector material (120, 520), and flexible material arranged to at least partially enclose the core; wherein the released extension (126, 526) is configured to be hingedly connected to the node (120, 520) and to fold towards the second major surface (106, 506). Methods related to the foldable layered connection are also disclosed.