ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

An electronic device (1) includes an electronic component (10) having electrodes (11, 12), a resin molded body (20) embedding the electronic component (10) such that the electrodes (11, 12) are exposed, a resin member (30) interposed between the resin molded body (20) and the electronic component (1...

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Bibliographische Detailangaben
1. Verfasser:	KAWAI, Wakahiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An electronic device (1) includes an electronic component (10) having electrodes (11, 12), a resin molded body (20) embedding the electronic component (10) such that the electrodes (11, 12) are exposed, a resin member (30) interposed between the resin molded body (20) and the electronic component (10) and exposed from the resin molded body (20), and wires (40, 41) formed on the resin molded body (20) and the resin member (30) and respectively connected to the electrodes (11, 12). Thereby, disconnection of the wires connected to the electronic component embedded in the resin molded body is less likely to occur.