METHOD FOR PRODUCING HOLLOW STRUCTURE, PLATED COMPOSITE AND HOLLOW STRUCTURE

The present invention provides a method for producing a hollow structure useful as a base material for a heat sink or the like which increases a heat dissipation property of devices mounted in various kinds of electronic apparatuses, without sacrificing downsizing, thinning, weight reduction, and multifunctionality, and provides a hollow structure. The method including: producing a plated composite by coating a surface of a core 1 made of aluminum to form a copper plating layer 3; cutting off part of the plated composite to expose cut surfaces of the core 1; and turning a part corresponding to the core 1 into a hollow part 5 by immersing the plated composite in a sodium solution which dissolves aluminum but does not dissolve copper and selectively dissolving and removing only the aluminum 1, thereby producing a hollow structure 5 whose skeletal part 5B is composed of all copper plating layers 3a, 3b, 3c.