ADHESIVE FOR THERMOCOMPRESSION MOLDING, WOODEN BOARD AND METHOD FOR PRODUCING SAME

The present invention aims to provide an adhesive for heat press molding which can be used to manufacture a wooden board having a water resistancy high enough for practical use without a decrease in bending strength. An adhesive for heat press molding according to the present invention contains a re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NAITO, Shigeki, UEYAMA, Yoshio
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUTORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTINGOF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NAILING OR STAPLING MACHINES IN GENERAL NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL
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Beschreibung
Zusammenfassung:	The present invention aims to provide an adhesive for heat press molding which can be used to manufacture a wooden board having a water resistancy high enough for practical use without a decrease in bending strength. An adhesive for heat press molding according to the present invention contains a reaction product obtained by heat treatment on a mixture containing a polycarboxylic acid and a saccharide.