SEMICONDUCTOR DEVICE

A semiconductor device includes a first metal plate having a first surface, a second metal plate having a second surface facing the first surface, and two or more semiconductor modules disposed between the first metal plate and the second metal plate. The two or more semiconductor modules each inclu...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE, Naotake, IIO, Naotaka, SEKIYA, Hiroki, ITO, Hiroaki, OHBU, Toshiharu, TAKIMOTO, Kazuyasu, HISAZATO, Yuuji, MATSUMURA, Hitoshi, ICHIKURA, Yuta, YAMANARI, Naoki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device includes a first metal plate having a first surface, a second metal plate having a second surface facing the first surface, and two or more semiconductor modules disposed between the first metal plate and the second metal plate. The two or more semiconductor modules each include a first metal member electrically connected to the first metal plate, a second metal member electrically connected to the second metal plate, at least one semiconductor element disposed between the first metal member and the second metal member, and a resin member for sealing the semiconductor element between the first metal member and the second metal member. The at least one semiconductor element has a first electrode electrically connected to the first metal member and a second electrode electrically connected to the second metal member.