REMOVAL OF PROCESS EFFLUENTS

Various embodiments comprise apparatuses and related method for cleaning and drying a substrate. In one embodiment, an apparatus includes a vertical substrate holder to hold and rotate the substrate at various speeds. An inner shield and outer shield, when in a closed position, surround the vertical substrate holder during operation of the apparatus. Each of the shields can operate independently in at least one of rotational speed and direction from the other shield. A front-side and back-side spray jet are arranged to spray at least one fluid onto both sides of the substrate and edges of the substrate substantially concurrently. A gas flow, combined with a high rotational-speed of the shields and substrate, assists in drying the substrate. At least one turbine disk is coupled in proximity to at least one of the shields to remove excess amounts of fluid. Additional apparatuses and methods of forming the apparatuses are disclosed.