ELECTRONIC COMPONENT

An electronic component (100) includes: a circuit board module (104) which is composed of a plurality of layers, and in which a primary circuit (120) and secondary circuits (122, 124) are each formed using wring patterns of a first layer (L1) to an eighth layer (L8); and a magnetic core (106) which magnetically couples the primary circuit (120) and the secondary circuits (122, 124). The circuit board module (104) includes: a primary winding (120b) and secondary windings (122b, 124b) which are formed spirally around the magnetic core (106); and a third layer (L3) and a sixth layer (L6) interposed between a fourth layer (L4) of the primary winding (120b) and a second layer (L2) of the secondary winding (122b) and between a fifth layer (L5) of the primary winding (120b) and a seventh layer (L7) of the secondary winding (124b). In the circuit board module (104), the third layer (L3) and the sixth layer (L6) function as insulating layers, leading to an improvement in the withstand performance of the electronic component (100).