REDOX ATOMIC LAYER DEPOSITION

Method to deposit a layer of inorganic material on a substrate surface, comprising one or more cycles, each cycle comprising the steps of:a) contacting the substrate surface with a first aqueous liquid solution comprising an organic compound having a functional group permitting its adsorption on the...

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Bibliographische Detailangaben
Hauptverfasser:	ZANKOWSKI, Stanislaw Piotr, VAN HOECKE, Laurens
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	Method to deposit a layer of inorganic material on a substrate surface, comprising one or more cycles, each cycle comprising the steps of:a) contacting the substrate surface with a first aqueous liquid solution comprising an organic compound having a functional group permitting its adsorption on the substrate, followed byb) contacting the substrate surface having the organic compound adsorbed thereon with a second liquid aqueous solution comprising an inorganic ion or an ion complex suitable for oxidizing the organic compound and having an insoluble reduction product which is the inorganic material.