PROTECTIVE FILM FOR ELECTRONIC DEVICE AND WINDOW ASSEMBLY USING THE SAME

A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Hoyoung, OH, Jeeyoung, KIM, Younggyun, SHIM, Choontaek, JEON, Jaeseon, HEO, Jaehyeok, HWANG, Sangil
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PAINTS PERFORMING OPERATIONS PHYSICS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be hardened responsive to receipt of an external stimuli; a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and an adhesive layer adhering to a lower surface of the deformable inner layer. Further, various embodiments can be implemented according to the present disclosure.