CIRCUIT BOARD, MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, PHOTOGRAPHING MODULE, AND ELECTRONIC DEVICE

The present invention provides a circuit board, a molded photosensitive assembly and manufacturing method therefor, a photographing module, and an electronic device. The circuit board comprises a substrate and at least one circuit portion formed on the substrate. A photosensitive element and the cir...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GUO, Nan, WANG, Mingzhu, CHEN, Zhenyu, ZHAO, Bojie, WANG, Yafei, TANAKA, Takehiko, CHENG, Duanliang
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention provides a circuit board, a molded photosensitive assembly and manufacturing method therefor, a photographing module, and an electronic device. The circuit board comprises a substrate and at least one circuit portion formed on the substrate. A photosensitive element and the circuit portion are conductively connected. The circuit portion forms a ring circuit in a edge region of the substrate. The ring circuit surrounds the photosensitive element, so that in a molding process, the photosensitive element can be protected by the ring circuit.