COMPONENT CARRIER WITH ONLY PARTIALLY FILLED THERMAL THROUGH-HOLE

A component carrier (100) which comprises at least one electrically conductive layer structure (102) and at least one electrically insulating layer structure (104), a through-hole (106) extending through the at least one electrically insulating layer structure (104), and highly thermally conductive...

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Bibliographische Detailangaben
Hauptverfasser:	Liebfahrt, Sabine, Grober, Gernot, Lutschounig, Ferdinand, Matt, Florian
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A component carrier (100) which comprises at least one electrically conductive layer structure (102) and at least one electrically insulating layer structure (104), a through-hole (106) extending through the at least one electrically insulating layer structure (104), and highly thermally conductive material (108) filling only part of the through-hole (106) so that a recess (110) is formed which is not filled with the highly thermally conductive material (108) and which extends at least from an outer face (114) of the at least one electrically insulating layer structure (104) into the through-hole (106), wherein a diameter, B, of the recess (110) at a level (116) of the outer face (114) of the at least one electrically insulating layer structure (104) and a width, A, of a web (118) of the highly thermally conductive material (108) at the level (116) of the outer face (114) of the at least one electrically insulating layer structure (104) fulfil the conditions B>A and A>B/20.