COMPOSITION COMPRISING POLYMER NANOPARTICLES FOR CONTROLLING RESIN REACTION RATES AND METHOD OF MANUFACTURING

A composition may include a thermosetting resin containing a plurality of polymer nanoparticles. At least some of the polymer nanoparticles may release either a catalyst or a hardener during a resin curing process. The catalyst or hardener may alter the reaction rate of the resin.

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Bibliographische Detailangaben
Hauptverfasser:	MEURE, Samuel J, KOZAR, Michael P, WILENSKI, Mark S
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NANOTECHNOLOGY NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	A composition may include a thermosetting resin containing a plurality of polymer nanoparticles. At least some of the polymer nanoparticles may release either a catalyst or a hardener during a resin curing process. The catalyst or hardener may alter the reaction rate of the resin.