WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD

A wiring board 1 includes: a support body 10 including at least one woven fabric 11 woven from weaving yarns 12 and 13 each formed by bundling insulating fibers 121 and 131; and a conductive body 20 supported by the support body 10, the conductive body 20 includes a first conductive path 21 which is...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KAIZU, Masahiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOOMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METHODS OF WEAVING PRINTED CIRCUITS TEXTILES WEAVING WOVEN FABRICS
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