WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD

A wiring board 1 includes: a support body 10 including at least one woven fabric 11 woven from weaving yarns 12 and 13 each formed by bundling insulating fibers 121 and 131; and a conductive body 20 supported by the support body 10, the conductive body 20 includes a first conductive path 21 which is...

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Bibliographische Detailangaben
1. Verfasser:	KAIZU, Masahiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOOMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METHODS OF WEAVING PRINTED CIRCUITS TEXTILES WEAVING WOVEN FABRICS
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Beschreibung
Zusammenfassung:	A wiring board 1 includes: a support body 10 including at least one woven fabric 11 woven from weaving yarns 12 and 13 each formed by bundling insulating fibers 121 and 131; and a conductive body 20 supported by the support body 10, the conductive body 20 includes a first conductive path 21 which is provided on a first main face 101 of the support body 10 and extends in a planar direction of the first main face 101, and the first conductive path 21 includes at least one of a first conductor portion 211 which exists in a basket hole 14 of the woven fabric 11 and a first intervening portion 212 which exists in a gap between the insulating fibers 121 and 131.