WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD

WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD

A wiring board 1 includes: a support body 10 including at least one woven fabric 11 woven from weaving yarns 12 and 13 each formed by bundling insulating fibers 121 and 131; and a conductive body 20 supported by the support body 10, the conductive body 20 includes a first conductive path 21 which is...

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1. Verfasser: KAIZU, Masahiro
Format: Patent
Sprache:eng ; fre ; ger
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LOOMS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METHODS OF WEAVING
PRINTED CIRCUITS
TEXTILES
WEAVING
WOVEN FABRICS
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creator KAIZU, Masahiro
description A wiring board 1 includes: a support body 10 including at least one woven fabric 11 woven from weaving yarns 12 and 13 each formed by bundling insulating fibers 121 and 131; and a conductive body 20 supported by the support body 10, the conductive body 20 includes a first conductive path 21 which is provided on a first main face 101 of the support body 10 and extends in a planar direction of the first main face 101, and the first conductive path 21 includes at least one of a first conductor portion 211 which exists in a basket hole 14 of the woven fabric 11 and a first intervening portion 212 which exists in a gap between the insulating fibers 121 and 131.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LOOMS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METHODS OF WEAVING
PRINTED CIRCUITS
TEXTILES
WEAVING
WOVEN FABRICS
title WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING METHOD
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