SYSTEMS, METHODS, AND APPARATUS FOR PASSIVE COOLING OF UAVS

An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operat...

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Bibliographische Detailangaben
Hauptverfasser:	CHIU, Chinchuan, Andrew, WANG, Peng, LE, Don, ANDERSON, Jon
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AEROPLANES AIRCRAFT ARRANGEMENTS OR MOUNTING OF POWER PLANTS OR PROPULSIONTRANSMISSIONS IN AIRCRAFT AVIATION BLASTING COSMONAUTICS EQUIPMENT FOR FITTING IN OR TO AIRCRAFT FLYING SUITS HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING HELICOPTERS LIGHTING MECHANICAL ENGINEERING PARACHUTES PERFORMING OPERATIONS TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.