ARRANGEMENT OF LEDS ON A LEADFRAME

A lighting device includes LED lighting elements arranged at a distance from each other. A leadframe comprising conductor segments interconnecting the LED lighting elements. The LED lighting elements each comprise an LED die element attached to one of the conductor segments of the leadframe. The LED...

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Bibliographische Detailangaben
Hauptverfasser:	KUIJPERS, Maurice, PETERS, Ralph, Hubert, CROMPVOETS, Floris, Maria, Hermansz, KLEIJNEN, Christian, EINIG, Rob, Bastiaan, Maria
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	A lighting device includes LED lighting elements arranged at a distance from each other. A leadframe comprising conductor segments interconnecting the LED lighting elements. The LED lighting elements each comprise an LED die element attached to one of the conductor segments of the leadframe. The LED lighting elements further each comprise a holding element disposed to hold at least two of the conductor segments of the leadframe which are partially embedded within one of the holding elements. In order to obtain good optical properties, the holding elements do not cover the LED die elements. According to the proposed manufacturing method, conductor segments of the leadframe are provided and holding elements are formed at a distance from each other, each partially embedding at least two conductor segments. Mounting portions on the conductor segments are not covered by the holding elements. LED die elements are attached to the mounting portions.