THERMOELECTRIC MODULE

The present invention provides a thermoelectric module comprising: plural thermoelectric elements comprising thermoelectric semiconductor; an electrode for connecting between the plural thermoelectric elements; and a joining layer for joining the thermoelectric element and electrode, positioned between each thermoelectric element and electrode, wherein the thermoelectric module further comprises a barrier layer comprising Cu-Mo-Ti alloy, positioned between the thermoelectric element and joining layer, thereby preventing heat diffusion of the material of a joining layer, preventing the oxidation and deformation of the thermoelectric element under high temperature environment, and exhibiting improved operational stability due to excellent adhesion to a thermoelectric element.