EMC COOLING DEVICE

The present disclosure relates to a cooling apparatus (1) comprising a metal and/or electrically conductive EMC enclosure (2) and a converter (E1) and also a plurality of electrically operated units (E2, . . . , En) within the EMC enclosure (2) which are designed to influence a local temperature in at least one region (30, 31) inside or outside the EMC enclosure (2), wherein the converter (E1) directly supplies at least one or more of the units (E2, . . . , En) with a respective supply voltage, and wherein the converter (E1) and the units (E2, . . . , En) are each designed such that the line-bound and/or field-bound interference (Sxy) which is specifically generated by this unit during operation of the cooling apparatus (1) is compensated for by a line-bound and/or field-bound interference (Sxy) of at least one of the respectively other units (E1, . . . , En) partially or completely in terms of its respective interference level (Pn).