ELECTRONIC DEVICE INSPECTING APPARATUS

Provided is an electronic device inspecting apparatus that suppresses cost increase. A prober 10 is provided with a stage 11 on which a carrier C or a wafer W is placed. The stage 11 is provided with a stage cover 27 on which the carrier C is placed, a cooling unit 29 in contact with the stage cover...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	FUJISAWA, Yoshinori, KASAI, Shigeru
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	Provided is an electronic device inspecting apparatus that suppresses cost increase. A prober 10 is provided with a stage 11 on which a carrier C or a wafer W is placed. The stage 11 is provided with a stage cover 27 on which the carrier C is placed, a cooling unit 29 in contact with the stage cover 27, and an LED irradiation unit 30 facing the carrier C across the stage cover 27 and the cooling unit 29. Each of the stage cover 27 and the cooling unit 29 is formed of a light transmitting material. A light-transmitting coolant flows in a coolant flow path 28 in the cooling unit 29. The LED irradiation unit 30 has a plurality of LEDs 32 oriented to the carrier C. The carrier C is formed of a glass substrate 24 having a substantially disc-like shape. A plurality of electronic devices 25 are arranged on a surface of the carrier C at predetermined intervals therebetween.