AUTOMATIC REGISTRATION BETWEEN CIRCUIT DIES AND INTERCONNECTS

Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces...

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Bibliographische Detailangaben
Hauptverfasser:	DODDS, Shawn C, NICCUM, Kayla, SHAH, Saagar A, CHIU, Jessica, METZLER, Thomas J, ZHU, James, MEYERS, Kara A, GOEDDEL, Teresa M, STAY, Matthew S, KEMLING, Jonathan W, SMITH, Matthew R. D, PEKUROVSKY, Lyudmila A, THEIS, Daniel J, LARSEN, Jeremy K, PEKUROVSKY, Mikhail L, BARTON, Roger W, MAHAJAN, Ankit, GILMAN, Ann M, HERNANDEZ, Joseph E
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.