METHOD OF LASER PROCESSING LAMINATE WORKPIECE STACKS WITH FORMING A CONTOUR LINE IN A FIRST TRANPARENT WORKPIECE AND THEN SEPARATING A RESIN LAYER FROM THE FIRST TRANSPARENT WORKPIECE

A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusi...

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Bibliographische Detailangaben
Hauptverfasser:	WIELAND, Kristopher Allen, NIEBER, Albert Roth
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.