LAYERED BODY AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

[Problem] To provide a laminate having a gel layer on a substrate able to protect the substrate during various types of processing used in industrial production steps prior to curing, the gel layer having excellent heat resistance, softness and flexibility, a low modulus of elasticity, low stress, e...

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Bibliographische Detailangaben
Hauptverfasser: TOYAMA Kyoko, FUKUI Hiroshi, USHIO Yoshito
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:[Problem] To provide a laminate having a gel layer on a substrate able to protect the substrate during various types of processing used in industrial production steps prior to curing, the gel layer having excellent heat resistance, softness and flexibility, a low modulus of elasticity, low stress, excellent stress buffering properties, and electronic component retention properties, and the gel layer having higher shape retention before curing but changing after curing into a hard layer having excellent release properties, the laminate being easily and readily releasable from the substrate even when the cured layer is localized, and to provide applications thereof (such as an electronic component manufacturing method). [Solution] A laminate comprising a laminated reaction-curable silicone gel and a sheet-like member laminated via an adhesive layer on top of the reaction-curable silicone gel, and a use thereof.