METHOD FOR NONDESTRUCTIVE INSPECTION BY ULTRASOUND OF A BONDED ASSEMBLY

A method for nondestructive inspection by ultrasound of a bonded assembly is provided. The method comprises two steps, consisting of measuring a thickness of an adhesive joint of the bonded assembly by an ultrasound transducer arranged on the bonded assembly in a determined position, and measuring t...

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Bibliographische Detailangaben
Hauptverfasser:	CUVILLIER, Nicolas, DUCOUSSO, Mathieu, Loïc
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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Beschreibung
Zusammenfassung:	A method for nondestructive inspection by ultrasound of a bonded assembly is provided. The method comprises two steps, consisting of measuring a thickness of an adhesive joint of the bonded assembly by an ultrasound transducer arranged on the bonded assembly in a determined position, and measuring the degree of adhesion of parts of the bonded assembly by the same ultrasound transducer maintained in the determined position, the degree of adhesion being measured by ZGV Lamb waves.