SOLVENT-LESS IONIC LIQUID EPOXY RESIN

Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y1-R1-Y2), wherein R1 is an ionic moiety Y1 is a nucleophilic group and Y2 nucleophilic group; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a molecular struct...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FRIESEN, Cody, BAUTISTA-MARTINEZ, Jose Antonio, GONCHARENKO, Mykhaylo, JOHNSON, Paul
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y1-R1-Y2), wherein R1 is an ionic moiety Y1 is a nucleophilic group and Y2 nucleophilic group; and an ionic moiety A acting as a counter ion to R1; and an epoxy compound E comprising: a molecular structure (Z1-R2-Z2), wherein R2 is an ionic moiety, Z1 comprises an epoxide group, and Z2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R2. In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crosslinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of used.