LASER BONDING APPARATUS AND METHOD FOR THREE-DIMENSIONAL STRUCTURE

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dim...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Byung Rock, CHOI, Jae Joon
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING ORSUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES INGENERAL BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING VEHICLES IN GENERAL
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Beschreibung
Zusammenfassung:	Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.