PACKAGE WITH INTEGRATED CIRCUIT DEVICES EMBEDDED IN ENCAPSULATING COMPOUND AND WITH CONDUCTIVE VIAS THROUGH THE ENCAPSULATING COMPOUND, AND METHODS OF MAKING SAME

PACKAGE WITH INTEGRATED CIRCUIT DEVICES EMBEDDED IN ENCAPSULATING COMPOUND AND WITH CONDUCTIVE VIAS THROUGH THE ENCAPSULATING COMPOUND, AND METHODS OF MAKING SAME

A device (400) is disclosed which includes at least one integrated circuit die (12), at least a portion of which is positioned in a body of encapsulant material (20), and at least one conductive via (32,34) extending through the body of encapsulant material.

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Bibliographische Detailangaben
Hauptverfasser: CHIA, Yong Poo, JIANG, Tongbi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A device (400) is disclosed which includes at least one integrated circuit die (12), at least a portion of which is positioned in a body of encapsulant material (20), and at least one conductive via (32,34) extending through the body of encapsulant material.