METHOD OF MANUFACTURING A LEAD FRAME

A method of manufacturing a lead frame, includes preparing a stamping arrangement to stamp a lead frame comprising a plurality of electrode contact regions, wherein complementary contact regions are separated by an initial gap width; and a number of connecting bars, wherein a connecting bar extends...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIE, Yuan, MERTENS, Juergen, LEE, Sze, Kuang, CHEN, Nan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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