METHOD OF MANUFACTURING A LEAD FRAME
A method of manufacturing a lead frame, includes preparing a stamping arrangement to stamp a lead frame comprising a plurality of electrode contact regions, wherein complementary contact regions are separated by an initial gap width; and a number of connecting bars, wherein a connecting bar extends...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A method of manufacturing a lead frame, includes preparing a stamping arrangement to stamp a lead frame comprising a plurality of electrode contact regions, wherein complementary contact regions are separated by an initial gap width; and a number of connecting bars, wherein a connecting bar extends between regions of the lead frame; using the stamping arrangement to stamp the lead frame; and deforming at least one connecting bar of the stamped lead frame to reduce the gap width between complementary contact regions to a final gap width. Further described is a lead frame comprising a plurality of LED electrode contact regions, with a gap width of at most 250 μm between complementary contact regions after the deformation step. The invention further describes an LED lighting device comprising such a lead frame and at least one LED die package mounted onto complementary electrode contact regions of the lead frame. |
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