HEAT DISSIPATION SHEET HAVING HIGH LOAD CARRYING CAPACITY AND HIGH THERMAL CONDUCTIVITY

Provided is a heat dissipation sheet which achieves a good balance between high load carrying capacity and high thermal conductivity at a low cost. A heat dissipation sheet having a configuration with silicone composition layers containing a thermal conductive filler each layered on both surfaces of...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	WADA, Kosuke, MITSUNAGA, Toshikatsu, YAMAGATA, Toshitaka, KANEKO, Masahide
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is a heat dissipation sheet which achieves a good balance between high load carrying capacity and high thermal conductivity at a low cost. A heat dissipation sheet having a configuration with silicone composition layers containing a thermal conductive filler each layered on both surfaces of a reinforcing layer, wherein in at least one of the silicone composition layers present on both surfaces of the heat dissipation sheet, a 10-point average roughness Rof the surface on the side not bonded to the reinforcing layer is in the range of 15 µm or more and 70 µm or less; a durometer A hardness of the silicone composition layers is in the range of 25 or more and 90 or less; and a thermal conductivity in a thickness direction of the heat dissipation sheet is 2.5 W/(m·K) or more.