METALLIC LAYER AS CARRIER FOR COMPONENT EMBEDDED IN CAVITY OF COMPONENT CARRIER

METALLIC LAYER AS CARRIER FOR COMPONENT EMBEDDED IN CAVITY OF COMPONENT CARRIER

A method of manufacturing a component carrier (100), wherein the method comprises providing a base structure (102) having a front side (104) and a back side (106), the back side (106) being at least partially covered by a metallic layer (108), removing material of the base structure (102) from the f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Galler, Christian, Morianz, Mike, Stubenberger, Gerhard
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of manufacturing a component carrier (100), wherein the method comprises providing a base structure (102) having a front side (104) and a back side (106), the back side (106) being at least partially covered by a metallic layer (108), removing material of the base structure (102) from the front side (104) to thereby form a cavity (110) which is at least partially closed by the metallic layer (108), and inserting a component (112) in the cavity (110) and placing the component (112) on the metallic layer (108).