LAMINATE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Problem: It is an object of the present invention to provide a laminate having, on a substrate, a gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress and excellent in stress buffering properties and flexibility, is soft and excellent in holding property...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DOGEN Ryota, TOYAMA Kyoko, FUKUI Hiroshi, USHIO Yoshito
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Problem: It is an object of the present invention to provide a laminate having, on a substrate, a gel layer which is excellent in heat resistance and the like, has low elastic modulus, low stress and excellent in stress buffering properties and flexibility, is soft and excellent in holding property of electronic components and the like before curing, and after curing, the gel layer is changed to a hard cured layer which is higher in shape retention and excellent in mold releasability than before curing, and a method for manufacturing the same. Further, it is an object of the present invention to provide a method for manufacturing an electronic component in which the use of the laminate makes it difficult to cause problems such as deposits of silicone gel or a cured product thereof to a substrate or an electronic component, and makes it difficult to cause problems of defects or defective products of the electronic component.Solution: A laminate including a curing reactive silicone gel layer on at least one type of substrate and its use.