SPLIT CHIP SOLUTION FOR DIE-TO-DIE SERDES

An SoC integrated circuit package is provided in which the analog components of a SerDes for an SoC die in the SoC integrated circuit package are segregated into a SerDes interface die in the SoC integrated circuit package.

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Bibliographische Detailangaben
Hauptverfasser:	KONG, Xiaohua, TERZIOGLU, Esin, CORLETO MENA, Jose Gilberto, ALLAM, Mohamed
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CODE CONVERSION IN GENERAL CODING DECODING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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Beschreibung
Zusammenfassung:	An SoC integrated circuit package is provided in which the analog components of a SerDes for an SoC die in the SoC integrated circuit package are segregated into a SerDes interface die in the SoC integrated circuit package.