ELECTRONIC DEVICE HOUSING, METHOD FOR MANUFACTURING ELECTRONIC DEVICE HOUSING, DEVELOPMENT PLAN-SHAPED METAL RESIN JOINT PLATE, AND ELECTRONIC APPARATUS

An electronic device housing (100) of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate (201), and metal side plates (202 (202-1, 202-2, 202-3, and 202-4)) folded and integrally connected to the bottom plate (201), in which...

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Bibliographische Detailangaben
Hauptverfasser:	SHINBORI, Nobuyoshi, NAITO, Shinya
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic device housing (100) of the present invention is a housing for internally accommodating an electronic device and is provided with a metal bottom plate (201), and metal side plates (202 (202-1, 202-2, 202-3, and 202-4)) folded and integrally connected to the bottom plate (201), in which, in a metal member (M) formed of at least the bottom plate (201) and the side plate (202), a thermoplastic resin member (301) is joined to a portion of the surface of the plate-shaped metal member (M), the metal member (M) is reinforced by a thermoplastic resin member (301), and the thermoplastic resin member (301) is joined to both surfaces of the plate-shaped metal member (M).