SEMICONDUCTOR DEVICES WITH REGROWN CONTACTS AND METHODS OF FABRICATION

An embodiment of a semiconductor device includes a semiconductor substrate (110) that includes a channel (107), a first dielectric layer (124) disposed over the semiconductor substrate, and a regrown contact (140) formed through a first opening (143) in the first dielectric layer. The regrown contac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HUANG, Jenn Hwa, YUE, Yuanzheng
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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