ELECTRONIC DEVICE

There is disclosed an electronic device comprising a die and at least one lead. The electronic device further comprises a corresponding at least one connector (212), the or each connector for connecting the die (202) to a corresponding lead or leads (210), and the or each connector (212) comprising a first end (218) disposed in bondable proximity to a complementary surface of the corresponding lead (210) and a second end (214) disposed in bondable proximity to a complementary surface of the die (202). An end portion of at least one of the first end (218) and second end (214) comprises a formation (226, 326, 426), the formation (226, 326, 426) in combination with the complementary surface (224) of one, or both, of the respective lead (210) or the die (202) defining therebetween a first region (228a, 328a, 428a) and at least a second region (228b, 328b, 428b) configured to attract by capillary action an electrically conductive bonding material to consolidate therein. There is also disclosed a connector for use in an electronic device.