IMPROVED HEAT DISSIPATION IN A LED LAMP
The present invention relates to A LED lamp (100). The novel structure of the LED lamp (100) enables a miniaturized device with effective heat dissipation. LED lamp comprises a metal body (200) with a cylindric lumen, a printed circuit board (300) with a plurality of installation holes (310), a LED...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present invention relates to A LED lamp (100). The novel structure of the LED lamp (100) enables a miniaturized device with effective heat dissipation. LED lamp comprises a metal body (200) with a cylindric lumen, a printed circuit board (300) with a plurality of installation holes (310), a LED (105) and wiring (101) providing energy to the LED and a multi-layer. The circular printed circuit board (300) is fitted within the cylindric lumen near the distal end of the metal body (200). The printed circuit board (300) is configured to facilitate effective dissipation of heat from the LED (105). |
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