PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE
Provided are a photosensitive resin composition which allows ring closure to be made with a high ring closure rate even at a low temperature and which causes a cured film obtained by curing the photosensitive resin composition to have a high glass transition temperature, and a cured film, a laminate...
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