PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE

PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE

Provided are a photosensitive resin composition which allows ring closure to be made with a high ring closure rate even at a low temperature and which causes a cured film obtained by curing the photosensitive resin composition to have a high glass transition temperature, and a cured film, a laminate...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IWAI Yu, BAERT Kasper, JANSSEN Dimitri, VANCLOOSTER Stefan
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Beschreibung
Zusammenfassung:Provided are a photosensitive resin composition which allows ring closure to be made with a high ring closure rate even at a low temperature and which causes a cured film obtained by curing the photosensitive resin composition to have a high glass transition temperature, and a cured film, a laminate, a method for producing the cured film, a method for producing the laminate, and a semiconductor device in which the photosensitive resin composition is used. The photosensitive resin composition includes a heterocyclic ring-containing polymer precursor, a thermal-base generator, and an organic compound containing a Group 4 element.